Quels matériaux métalliques sont inclus dans l'alliage de cuivre de tungstène?

Tungsten-copper alloy combines the advantages of metal tungsten and copper. Among them, tungsten has a high melting point (the melting point of tungsten is 3410°C and the melting point of copper is 1080°C) and high density (the density of tungsten is 19.34g/cm3 and the density of copper is 8.89 g/cm3) ; Copper has excellent electrical and thermal conductivity. Tungsten-copper alloy (generally composed in the range of WCu7~WCu50) has a uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; it has moderate electrical and thermal conductivity and is widely used in military high-temperature resistant materials. , electrical alloys for high-voltage switches, electrical machining electrodes, and microelectronic materials, as parts and components, are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries.

Physical indicators:

Brand number	Specific gravity	Heat conductivity	Coefficient of thermal expansion
WCu7	17.5	150	5.5
WCu10	17.0	160	6.2
WCu15	16.2	170	6.9
WCu20	15.4	180	7.4
WCu25	14.7	200	8.0
WCu230	14.1	220	8.8

1. Military high temperature resistant materials

Tungsten-copper alloys are used in aerospace as nozzles, gas rudders, air rudders, and nose cones for missiles and rocket engines. The main requirements are high temperature resistance (3000K~5000K) and high-temperature airflow resistance. Copper is mainly used under high temperatures. The refrigeration effect of sweating caused by volatilization (the melting point of copper is 1083°C) reduces the surface temperature of tungsten copper, ensuring its use under extreme conditions of high temperature.

2. Electrical alloys for high-voltage switches

Tungsten copper alloy is widely used in high-voltage switches, 128kV SF6 circuit breakers WCu/CuCr, and high-voltage vacuum load switches (12kV 40.5KV 1000A) and arresters. High-voltage vacuum switches are small in size, easy to maintain, have a wide range of use, and can be used in wet, Used in flammable, explosive and corrosive environments. The main performance requirements are resistance to arc ablation, resistance to fusion welding, small cut-off current, low gas content, and low thermal electron emission capability. In addition to conventional macroscopic performance requirements, porosity and microstructural properties are also required, so special processes must be adopted, including complex processes such as vacuum degassing and vacuum infiltration.

3. Electrical machining electrodes

In the early days of EDM electrodes, copper or graphite electrodes were used, which were cheap but not resistant to ablation. They have basically been replaced by tungsten copper electrodes. The advantages of tungsten copper electrodes are high temperature resistance, high temperature strength, arc ablation resistance, good electrical and thermal conductivity, and fast heat dissipation. Applications focus on spark electrodes, resistance welding electrodes and high-voltage discharge tube electrodes.

The characteristics of electrical machining electrodes are a wide variety of specifications, small batches and large total quantities. Tungsten copper materials used as electrical machining electrodes should have the highest possible density and structural uniformity, especially slender rod-shaped, tubular and special-shaped electrodes.

4. Microelectronic materials

Tungsten copper electronic packaging and heat sink materials have both the low expansion characteristics of tungsten and the high thermal conductivity characteristics of copper. Its thermal expansion coefficient and thermal conductivity can be changed by adjusting the composition of tungsten copper, thus providing tungsten copper with more advantages. Wide range of applications. Because tungsten copper material has high heat resistance and good thermal and electrical conductivity, and has a thermal expansion coefficient that matches silicon wafers, gallium arsenide and ceramic materials, it is widely used in semiconductor materials. Suitable for high-power device packaging materials, heat sink materials, heat dissipation components, ceramics and gallium arsenide bases, etc.